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Self assembly polymer

Laura HorcajadaLaura Horcajada

Interlayer dielectric film, and method for forming the same and interconnection

The interlayer dielectric film made of a three-dimensionally polymerized polymer is formed by polymerizing: first cross-linking molecules having three or more sets of functional groups in one molecule providing a three-dimensional structure; and a second cross-linking molecule having two sets of functional groups in one molecule providing a two-dimensional structure. In the three-dimensionally polymerized polymer, dispersed are a number of molecular level pores formed by the polymerization of the first and second cross-linking molecules.

Publication number: US2005173804A1 | Search similar patents

Organic polymer film and method for forming the same

A method for forming an organic polymer film includes a step of polymerizing a monomer including an adamantane derivative in which a substituent group having a carbon number of 1 or more, a functional group or a functional group bonded to a substituent group is bonded to at least the 1-, 3-, 5- and 7-positions of an adamantane skeleton.

Publication number: US2007191585A1 | Search similar patents

Surface modification method and surface modification apparatus for interlayer insulating film

A surface modification method and a surface modification apparatus for interlayer insulating films are disclosed which enable to improve adhesion properties of an interlayer insulating film without changing the dielectric constant. An interlayer insulating film is formed on a semiconductor wafer (10) by firing a coating film. The surface of the interlayer insulating film is modified by heating the inside of a reaction tube (2), where the semiconductor wafer (10) is housed, to a certain temperature while supplying a gas with oxidizing activity into the reaction tube (2). The gas with oxidizing activity is ozone, water vapor, oxygen or a mixed gas of hydrogen and oxygen.

Publication number: WO2004095563A1 | Search similar patents

Interlayer for laminated glass, and laminated glass

Provided are an interlayer for laminated glass and laminated glass using the interlayer for laminated glass. The interlayer for laminated glass enables the production of laminated glass exhibiting heightened sound insulating properties. The interlayer (1) for laminated glass according to the present invention includes a modified polyvinyl acetate and a plasticizing agent. The modified polyvinyl acetate contains a vinyl acetate structural unit and a fatty acid vinyl ester structural unit. The laminated glass according to the present invention is provided with a first laminated glass constituent member, a second laminated glass constituent member, and an interlayer sandwiched between the first and second laminated glass constituent members. The interlayer in the laminated glass according to the present invention is the interlayer for laminated glass described above.

Publication number: WO2014069593A1 | Search similar patents

Methods and structures for detecting low strength in an interlayer dielectric structure

A method for manufacturing a semiconductor device is disclosed. The method includes generating a thermo-mechanical stress within a plurality of layers of a wafer, and after generating the thermo-mechanical stress, testing an interfacial strength level associated with one or more of the plurality of layers.

Publication number: US2016027705A1 | Search similar patents

Interlayer for laminated glass, and laminated glass

An interlayer for laminated glass is provided which is capable of improving the flexural rigidity of laminated glass, and which is capable of improving the sound insulation properties of laminated glass. An interlayer for laminated glass according to the present invention is provided with a structure having one layer or a structure having two or more layers, and is provided with a first layer which includes a thermoplastic resin. The glass transition temperature of the first layer is not more than 10?C. The equivalent rigidity of the interlayer for laminated glass at 25?C is at least 2.4 MPa.

Publication number: WO2016039471A1 | Search similar patents

Capacitor

The present invention provides a capacitor that has high mechanical strength. The capacitor according to the present invention comprises: a porous metal substrate; a dielectric layer that is formed upon the porous metal substrate; an upper electrode that is formed upon the dielectric layer; a first terminal electrode that is electrically connected to the porous metal substrate; and a second terminal electrode that is electrically connected to the upper electrode. The porous metal substrate has a high-porosity part and low-porosity parts, the low-porosity parts being located at a pair of side-surface parts that are opposite each other on the porous metal substrate.

Publication number: WO2015118901A1 | Search similar patents

Dielectric material and electrochemical element comprising same

Disclosed are: a dielectric material (a material for a polarizable electrode) which enables the production of an electric double-layer capacitor without requiring any production process that is expensive like conventional production processes using active carbon or a carbon nanotube; and a dielectric material which has high electrostatic capacity (a C value) and enables the production of an electric double-layer capacitor having a higher withstand voltage than those of conventional electric double-layer capacitors. In the dielectric materials, a carbon component produced by mixing an insulating oil with an inorganic acid is used.

Publication number: WO2011055549A1 | Search similar patents

Method of synthesizing polymeric material, method of forming thin polymer film, and method of forming interlayer dielectric

A Lewis acid-base reaction is caused, in a solution, between a first monomer corresponding to a Lewis acid and a second monomer corresponding to a Lewis base, so as to generate a monomer adduct in which the first monomer and the second monomer are bonded to each other through weak electric interaction. Next, the solution including the monomer adduct is applied on a substrate so as to form a supramolecular solid thin film made of the monomer adduct. Then, the supramolecular solid thin film is heated so as to cause a polymerization reaction between the first monomer and the second monomer within the supramolecular solid thin film, thereby forming a polymer thin film.

Publication number: EP1493771A1 | Search similar patents

Semiconductor device and method of manufacturing the same

A semiconductor device having a first interlayer insulating film and a second interlayer insulating film comprising a carbon-containing inorganic insulating film (23) which is formed on the first interlayer insulating film and contains Si, O, C and H as the fundamental constituents, wherein the first interlayer insulating film has a hydrocarbon-type organic insulating film (22), which contains C, H and O as the fundamental constituents, at the interface with the second interlayer insulating film.

Publication number: WO2008120369A1 | Search similar patents

Method of forming interlayer insulating film, precursor solution for forming of interlayer insulating film, cvd material for forming of interlayer insulating film and raw material for production of siloxane oligomer

In a method of forming an interlayer insulating film by plasma CVD, an organic siloxane compound including one or more silicon atoms each having at least three or more units each represented by a general formula, —O—Si(R1R2)—OR3 (wherein R1 and R2 are the same as or different from each other and are a methyl group, an ethyl group or a propyl group, and R3 is the same as or different from R1 and R2 and is a methyl group, an ethyl group, a propyl group or a phenyl group) is used as a raw material.

Publication number: WO2006137196A1 | Search similar patents

Interlayer insulating film, method for forming the same and polymer composition

The interlayer insulating film of this invention is composed of a polymer in which a first monomer having a substituted acetylenyl group and polymerizable in the three-dimensional direction and a second monomer having a substituted cyclopentanonyl group and polymerizable in the two-dimensional direction are three-dimensionally polymerized.

Publication number: EP1388548A2 | Search similar patents

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