A cooling device for cooling a fluid comprises a vertical cooling tower, into an upper area of which the fluid to be cooled is fed and from a lower area of which the cooled fluid is discharged. The fluid in the cooling tower is cooled by a cooling gas flowing from the bottom to the top. At least one installation in which the fluid is conducted is provided in the gas space of the cooling tower through which cooling gas flows. Each installation comprises at least one fluid channel that is separated at least in part from the gas space of the cooling tower by a fluid-tight membrane wall that is permeable to vapour on both sides.
Publication number: WO2013104640A2 | Search similar patents
Wet cooling tower
The invention relates to a wet cooling tower in a block arrangement, whereby each block comprises several cells, characterised in that a block arrangement comprises at least 2+n (n = 1, 2, 3 ) cells in a longitudinal direction and at least 2+m (m = 1, 2, 3, ) in a transverse direction running perpendicular to the longitudinal direction.
Publication number: EP1864067A2 | Search similar patents
Cooling device and cooling arrangement including cooling device
The invention relates to a cooling device for heat-emitting components, wherein at least one component is arranged on a printed circuit board and wherein the cooling device includes a first cooling member and a second cooling member. The two cooling members are arranged on the printed circuit board adjacent to and at a predetermined distance from the at least one component on opposite sides of the component. The invention further relates to a cooling arrangement for cooling at least one heat-emitting component arranged on a printed circuit board, wherein use is made of the cooling device.
Publication number: US2015257309A1 | Search similar patents
Cooling device for a printed circuit board
The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink (9) brazed to said at least one face of the printed circuit, in which said at least one heat sink (9) can be disposed in a flow of coolant. The invention is suitable for motor vehicles.
Publication number: WO2014095610A1 | Search similar patents
Heat sink for cooling an electrical component
The invention relates to a heat sink (1) for cooling an electrical component. The heat sink (1) is used in a power converter device (21), in particular, at least for cooling the power semiconductors (53) present there. The heat sink (1) according to the invention serves for combining two cooling devices. For this purpose, the heat sink is configured in such a way that it has a first cooling device (5) and a contact area (9), which is provided for dissipating thermal energy to a second cooling device (15), or that the heat sink (1) has a first cooling device (5) and a second cooling device (15).
Publication number: WO2008040596A2 | Search similar patents